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Miniaturization
Due to more functionalities in smart phone, wearable devices, and modules, the high density component mounting needs to be realized. YAGEO's small size MLCCs with accurate dimension control reveal effective pick & place implementation in addition to the required reliability.
CC 01005
Miniaturization
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Application
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※ Reminder: In case you need to dispose of this product for EOL or other reasons, please follow local disposal policy.
※ YAGEO Corporation and its affiliates do not recommend the use of commercial or automotive grade products for high reliability applications or manned space flight. Disclaimer
※ YAGEO Corporation and its affiliates do not recommend the use of commercial or automotive grade products for high reliability applications or manned space flight. Disclaimer
